Rationale
New system software is essential for using emerging memory technologies effectively. Novel memory types, interfaces, and capabilities are challenging long-held assumptions underlying memory system design and operation. Instead of traditional volatile, passive, and largely homogeneous DDR DRAM, future systems will increasingly include integrated HBM, cost-effective local memory tiers, and disaggregated far memory. “In-memory” and “near-memory” processing promise low-power parallel processing that will scale with the amount of active data. New memory interconnects such as UALink and CXL will enable independently scaling compute and memory and permit heterogeneous pooling and sharing of memory between machines.
Beyond lower energy consumption and higher processing power, these memory innovations also promise to disrupt with lower cost, higher capacity, or higher reliability. The Workshop on Disruptive Memory Systems (DIMES) is intended to be a forum to discuss new architectures, abstractions, and interfaces for system software to enable and exploit these new memory technologies in future software. The scope of DIMES covers system software for all computing domains: cloud, HPC, edge, desktop, mobile and embedded systems.
Suggested Topics
DIMES focuses on the system software aspects of disruptive memory technologies. Suggested topics for submissions include all aspects of system software that are affected by emerging memory technologies in cloud, HPC, edge, desktop, mobile and embedded systems, and related domains.
Topics of interest include, but are not limited to:
- memory system design
- memory management abstractions
- operating system support for memory management
- memory-centric programming models
- emerging memory technologies
- memory-intensive applications
- evaluation of memory-centric systems
We encourage authors to submit papers on concepts, early-stage work, and demos of prototype systems.
Important Dates
| Paper/demo submission deadline: | May 29, 2026 |
| Acceptance notification: | July 10, 2026 |
| Final camera-ready paper due: | August 28, 2026 |
| Workshop presentations: | September 29, 2026 |
Workshop Program
TBA
Venue and Registration
DIMES'26 is co-located with SOSP'26 and registrations will be handled on their website.